August 15-18, 2011, Portland, Oregon
  

NANO 2011 Paper Abstract

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Paper TuA2T6.3

Falat, Tomasz (Wroclaw University of Technology), Felba, Jan (Wroclaw University of Technology), Platek, Bartosz (Wroclaw University of Technology, Faculty ofMicrosystemElectroni), Marcq, Fabien (Université de Toulouse, Institut Carnot CIRIMAT, Université Paul), Demont, Philippe (Université de Toulouse, Institut Carnot CIRIMAT, Université Paul), Monfraix, Philippe (Thalès Alenia Space), Moscicki, Andrzej (Amepox Microelectronics, Lodz, Poland), Poltorak, Krzysztof (Amepox Microelectronics, Lodz, Poland), Matkowski, Przemyslaw (Wroclaw University of Technology, Faculty of Microsystem Electro)

Electrical, Thermal and Mechanical Properties of Epoxy Composites with Hybrid Micro and Nano Sized Fillers for Electronic Packaging

Scheduled for presentation during the Oral Session "NanoPackaging" (TuA2T6), Tuesday, August 16, 2011, 11:20−11:40, Mt Hood

IEEE NANO 2011 Conference, August 15-18, 2011, Portland Marriott Downtown, Portland, Oregon, USA

This information is tentative and subject to change. Compiled on May 24, 2018

Keywords Nanopackaging, Nanomaterials

Abstract

Combining conductive micro and nanofillers is a new way to improve electrical, thermal and mechanical properties of polymer composites for electronic packaging. Micrometric silver flakes and nanometric carbon nanotubes (CNTs) exhibit high electrical and thermal conductivity. Moreover CNTs improve strength, stiffness and fracture toughness of the polymer matrix. A new type of hybrid conductive adhesives filled with silver flakes and carbon nanotubes were investigated. Thermal and electrical conductivities are measured as well as improved mechanical properties are evaluated based on the reliability tests of joints made of tested material. The electrical, thermal and mechanical properties are consistent with the morphologies of the hybrid composites characterized by SEM.

 

 

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