August 15-18, 2011, Portland, Oregon

NANO 2011 Paper Abstract


Paper TuPoT10.1

Falat, Tomasz (Wroclaw University of Technology), Felba, Jan (Wroclaw University of Technology), Moscicki, Andrzej (Amepox Microelectronics, Lodz, Poland), Borecki, Janusz (Tele and Radio Research Institute, Center for Advanced Technolog)

Nano-Silver Inkjet Printed Interconnections through the Microvias for Flexible Electronics

Scheduled for presentation during the Poster Session "Nanoelectronic Devices: Poster Session" (TuPoT10), Tuesday, August 16, 2011, 10:00−19:30, Exhibition Hall

IEEE NANO 2011 Conference, August 15-18, 2011, Portland Marriott Downtown, Portland, Oregon, USA

This information is tentative and subject to change. Compiled on December 15, 2018

Keywords Nanoelectronics: Devices - SET, RTD, QD, Molecular, Memristors, Industrial applications & commercialization, Nanomaterials


In the recent years the huge demand for miniaturized, highly functional and also more and more reliable electronic equipment is observed. The development of electronic industry strongly depends not only on the scale of electronic components miniaturization but also depends on miniaturization and kind of printed circuit boards (PCBs). Nowadays, the flexible substrates plays more and more important role in electronics. Organic flexible electronics are being developed for computer displays, radio frequency identification tags, sensors and actuators, solar cells and for much other devices. The use of polymer-based substrates, coupled with an inkjet printing technique opens up the possibility of cost-effective processing in high volumes by use of roll-to-roll processing. Double-sided circuits requires the electrically conductive interconnections between both layers. The big challenge is the manufacturing of surface layouts and vertical interconnections in flexible substrates in the same process without an involvement of other technologies. In the current paper the idea of through-hole microvias metalization by using the inkjet printing technique is presented.



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